HS6300/8000 II Next-Generation High-speed Horizontal Machining Center
Horizontal Machining Center HS6300/8000 II, designed by Hyundai WIA with years of expertise and the latest technology, provides high speed, high performance and maximum productivity.
Next Generation High Efficiency Machining Center
High Quality & Productivity Horizontal Machining Center
1Highly Rigid Box-type Bed
Unlike the previous reverse T-shaped structures, HS6300/8000 II has a horizontally symmetrical design with the Z-axis transfer system at the center of the material. In particular, a boxed bed design with extremely high rigidity not only secured the structural stability but also improved vibration absorption, enabling ample medium cutting and excellent illumination for machining with a symmetrical structure on the Z-axis.
2Changed Chip Disposal Structure
Designed to directly drop chips onto the chip conveyor, HS6300/8000 II enables seamless chip disposal even during mass chip generation. (Chip processing capability has been greatly improved compared to the screw-type chip conveyor in existing machines.)
3Step Type Bed Structure
It is designed to minimize the load occurring at the front. Also, travel stability is increased by column weight optimization.
High-Speed Roller Type Guideway
Linear roller guideways are applied to reduce non-cutting time and bring high rigidity. Each axis is directly connected to a highly reliable digital servo motor to provide high rigidity and minimal thermal displacement.
Large Ball Screw
The increased diameters of all ball screws allow for high accuracy even during heavy duty machining.
|HS6300 II||1,050/900/1,000 mm
|HS8000 II||1,400/1,200/1,370 mm
Rapid Traverse Rate (X/Y/Z)
|HS6300 II||60/60/60 mm
|HS8000 II||50/50/50 mm
HS8000 II Expansion of Transfer Distance